Silicon Integrated Systems Corporation

Silicon Integrated Systems Company

Mu-Sheng Liao

Yi-Chang Hsieh

Lai-Fue Hsieh

Ching-Jung Huang

Wei-Feng Lin

Chen-Wen Tsai

Fu-Tsai Chen

Pao-Chuan Kuo

Hsiu-Chu Chou

A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas, each of which is disposed corresponding to a lead of a packaged IC for testing connection, such as a quad flat packaged IC (QFP), a dual inline packaged IC (DIP) or a small outline packaged IC (SOP). The bonding pads on the load board connect the leads of the testing IC directly during IC testing, thus the conventional test socket between a conventional load board and a packaged IC is omitted.

Load board

A testing jig for semiconductor components, mainly comprising a main jig body, wherein on its bottom is provided with a retrieving head. While on the center of the bottom of the retrieving head is provided with a concave space, around which is arranged a plurality of air holes which are connected with the internal airways and also connected with the air inlet on the top of the main body. Furthermore, on the bottom of the main jig body is provided with two buffer blocks on opposite sides, which can prevent the chip on the center of the base board from being contacted with external force or foreign objects in the process of retrieving the base board during testing.

Jigs for semiconductor components

An apparatus for preventing electrostatic destruction of integrated circuits coats an electrostatic agent on surfaces of the integrated circuits to avoid accumulation of static electricity caused by dynamic contact friction. The apparatus comprises a belt, at least one motor, at least one spray nozzle, at least one dispenser or controller and at least one photo switch. The integrated circuits are placed on the belt. The motor drives the belt and therefore the integrated circuits step by step to the spray nozzle to coat the electrostatic agent on the surfaces of the integrated circuits. The controller controls the output rate of the electrostatic agent from the spray nozzle. The photo switch is connected to the spray nozzle and dispenser to detect the integrated circuits as they pass the spray nozzle.

Apparatus for eliminating electrostatic destruction

An apparatus is adapted for picking-up an integrated circuit component and is adapted to be connected to an air pump. The apparatus includes a retaining block formed with a first pipe hole and a washer receiving recess for receiving a washer. An air pipe is formed with a radially and outwardly extending rim flange at a junction of upper and lower pipe sections thereof. The lower pipe section extends sealingly through a second pipe hole in the washer and further through the first pipe hole such that the rim flange rests on top of the washer in the washer receiving recess, such that a distal lower end of the lower pipe section projects downwardly relative to the retaining block, and such that a distal upper end of the upper pipe section extends outwardly of the washer receiving recess and projects upwardly relative to the retaining block. A coupling base is mounted on top of the retaining block, and includes a horizontal base wall formed with a third pipe hole extending through top and bottom sides thereof and a spring receiving recess formed in the bottom side. A compression spring is sleeved around a guide tube that extends downwardly from the base wall and into the washer receiving recess. The compression spring has an upper spring portion disposed in the spring receiving recess, and a lower spring portion disposed in the washer receiving recess.

Apparatus for picking-up an integrated circuit component

A testing apparatus for testing a ball grid array (BGA) device, includes a movable carrier which has a top face recessed to form a cavity of square shape to receive the BGA device. A centering member is disposed at a center part of a cavity bottom face of the cavity to center a squarely looped array of voltage source solder balls formed at a bottom face of the BGA device, relative to the center part of the cavity bottom face. The centering member projects upward from the cavity bottom face to engage and prevent positional deviation of the squarely looped array of the voltage source solder balls when the BGA device is seated on the cavity bottom face. The testing apparatus further includes a testing circuit unit, a surface mount matrix disposed on top of the testing circuit unit, and a hollow frame member mounted on top of the surface mount matrix. The frame member has a square central opening to expose the surface mount matrix, and the surface mount matrix can make a direct electrical contact with the BGA device when the latter is placed in the central opening.

Testing apparatus for testing a ball grid array device

A contactor system is adapted for use when testing a ball grid array (BGA) device, and includes a conductive socket that is retained on a testing board and that establishes a ground connection therewith. The socket is formed with a receiving space adapted for receiving the BGA device therein. An insulating guide unit is mounted on the socket in the receiving space and is adapted to guide loading movement of the BGA device into the receiving space via an open top section of the latter and to prevent undesired electrical contact between the socket and the BGA device. A surface mount matrix is disposed on top of the testing board and is clamped between the socket and the testing board. The surface mount matrix is accessible via an open bottom section of the receiving space, and is adapted to contact solder balls on the BGA device directly so as to establish electrical connection between the BGA device and testing circuit layout on the testing board.

Growing community of inventors

Hsinchu, Taiwan

Mu-Sheng Liao