Mototsugu Ogasa

Title: Mototsugu Ogasa: Innovator in Electronic Component Packaging

Introduction

Mototsugu Ogasa is a notable inventor based in Kakogawa, Japan. He has made significant contributions to the field of electronic component packaging. His innovative approach has led to the development of a unique electronic component package that enhances the reliability and efficiency of electronic devices.

Latest Patents

Ogasa holds a patent for an electronic component package. This invention involves mounting an electronic component element on a metal base, which is then covered by a metal cap. The metal base and cap are joined through resistance welding, creating a hermetically sealed environment for the electronic component. A distinctive feature of this package is a protrusion on the metal base that contacts the metal cap, with a projection tip that has a flat face. Additionally, the protrusion can have a cross-sectional shape that combines an arc member with the top side of an isosceles trapezoid. This design improves the overall performance and durability of electronic components.

Career Highlights

Mototsugu Ogasa is associated with Daishinku Corporation, where he has been instrumental in advancing electronic packaging technologies. His work has not only contributed to the company's success but has also set new standards in the industry.

Collaborations

Ogasa has collaborated with notable colleagues, including Kazuhiko Kumatani and Yoshihisa Takano. These partnerships have fostered innovation and have played a crucial role in the development of advanced electronic components.

Conclusion

Mototsugu Ogasa's contributions to electronic component packaging demonstrate his commitment to innovation and excellence. His patented designs are paving the way for more reliable electronic devices, showcasing the importance of inventive thinking in technology.