The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2011

Filed:

Oct. 19, 2007
Applicants:

Kazuhiko Kumatani, Kakogawa, JP;

Yoshihisa Takano, Kakogawa, JP;

Naotoshi Nakamura, Kakogawa, JP;

Mototsugu Ogasa, Kakogawa, JP;

Takashi Nakamura, Kakogawa, JP;

Minoru Iizuka, Kakogawa, JP;

Inventors:

Kazuhiko Kumatani, Kakogawa, JP;

Yoshihisa Takano, Kakogawa, JP;

Naotoshi Nakamura, Kakogawa, JP;

Mototsugu Ogasa, Kakogawa, JP;

Takashi Nakamura, Kakogawa, JP;

Minoru Iizuka, Kakogawa, JP;

Assignee:

Daishinku Corporation, Kakogawa-shi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H05K 5/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided an electronic component package, in which electronic component element is mounted on a metal base, the electronic component element is covered by placing a metal cap over the metal base, and the metal base and the metal cap are joined by resistance welding to hermetically seal the electronic component element. With this electronic component package, a protrusion is provided to a portion of the metal base that comes into contact with the metal cap, and a projection tip of the protrusion has a flat face. Alternatively, the protrusion has a cross sectional shape that combines an arc member with the top side of an isosceles trapezoid.


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