This inventor holds 1 USPTO granted patent and 7 published patent applications. Top assignee: Denka Company Limited. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Motoi Nagasawa: Inventor of a Copper-Diamond Composite
Introduction
Motoi Nagasawa is an inventor based in Tokyo, Japan, associated with Denka Company Limited. His patent work focuses on materials designed to improve heat dissipation in electronic devices.
Latest Patents
Nagasawa is named on 1 patent: “Copper-Diamond Composite, Heat Dissipation Member, and Electronic Device.” The invention describes diamond particles dispersed in a copper-containing metal matrix. It specifies that the number-average sphericity of the diamond particles, measured using an image particle size distribution analyzer, is at least 0.90. The composite is intended for use in heat-dissipation members and electronic devices.
Career Highlights
The patent reflects work on copper-diamond materials and their potential application in thermal management. Such materials can be relevant to electronic devices that need to transfer heat effectively.
Collaborations
Nagasawa’s listed coworkers include Noriyoshi Sakai and Hyojin Noguchi. The patent information connects his work with Denka Company Limited.
Conclusion
Motoi Nagasawa’s recorded invention concerns a copper-diamond composite designed for heat dissipation, highlighting his contribution to materials innovation for electronic applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile