The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2026
Filed:
Aug. 01, 2022
Applicant:
Denka Company Limited, Tokyo, JP;
Inventors:
Assignee:
Denka Company Limited, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 26/00 (2006.01); B22F 3/105 (2006.01); C22C 1/05 (2023.01); C22C 9/00 (2006.01); H10W 40/25 (2026.01);
U.S. Cl.
CPC ...
C22C 26/00 (2013.01); B22F 3/105 (2013.01); C22C 1/05 (2013.01); C22C 9/00 (2013.01); H10W 40/254 (2026.01); B22F 2003/1051 (2013.01); B22F 2202/13 (2013.01); B22F 2301/10 (2013.01); B22F 2302/406 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01);
Abstract
A copper-diamond composite () according to the present invention includes a plurality of diamond particles () that are dispersed in a metal matrix () containing copper, in which when a particle size distribution of the diamond particles () is measured using an image particle size distribution analyzer, a number average of a sphericity distribution of the diamond particles () is 0.90 or more.
Quick Actions:
Noguchi, Hyojin. (2026). Copper-diamond composite, heat dissipation member, and electronic device (U.S. Patent No. 12612682). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12612682
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile