This inventor holds 1 USPTO granted patent. Top assignee: Kabushiki Kaisha Shinkawa. Active years: 1999.
Company Filing History:
Years Active: 1999
Title: Motohiko Katoh: Innovator in Semiconductor Technology
Introduction
Motohiko Katoh is a notable inventor based in Higashikurume, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to bump forming methods.
Latest Patents
One of Motohiko Katoh's key patents is a bump forming method. This method involves forming a bump on an electrode of a semiconductor device using a wire. The process includes forming a ball at the end of the bonding wire, pressing the ball against the electrode, and then separating the ball from the wire by cutting it with a pair of cutters that advance toward each other along the diameter of the wire. The cut surface of the ball or bump can be flattened by the cutters that press the cut surface. This invention enhances the efficiency and effectiveness of semiconductor device manufacturing.
Career Highlights
Motohiko Katoh is associated with Kabushiki Kaisha Shinkawa, where he has been able to apply his expertise in semiconductor technology. His work has contributed to advancements in the industry, showcasing his skills as an inventor.
Collaborations
Motohiko has collaborated with notable colleagues such as Akio Bando and Hirofumi Moroe. Their combined efforts have fostered innovation and development within their field.
Conclusion
Motohiko Katoh's contributions to semiconductor technology through his innovative bump forming method highlight his role as a significant inventor. His work continues to influence the industry and pave the way for future advancements.