Location History:
- Tochigi, JP (1999 - 2014)
- Kanuma, JP (2006 - 2019)
- Tatebayashi, JP (2021)
Company Filing History:
5 out of 682 
4 out of 186 
2 out of 58,130 
Years Active: 1999-2025
Title: Morio Sekiguchi: Innovator in Smart Card Technology
Introduction
Morio Sekiguchi is a prominent inventor based in Tochigi, Japan, known for his significant contributions to smart card technology. With a total of 12 patents to his name, Sekiguchi has developed innovative methods that enhance the reliability and performance of electronic components.
Latest Patents
One of Sekiguchi's latest patents is a method for manufacturing a smart card that achieves excellent connection reliability and bending resistance. This invention involves a conductive particle-containing hot-melt adhesive sheet that is interposed between a card member and an IC chip. The sheet contains solder particles of a non-eutectic alloy in a binder made of crystalline polyamide with a carboxyl group. This unique combination improves solder wettability, ensuring reliable connections while maintaining the adhesive layer's elastic modulus. Another notable patent is a method for manufacturing a mounting body that utilizes an anisotropic conductive film. This film contains an epoxy resin binder and conductive particles, allowing for the efficient mounting and remounting of electronic components.
Career Highlights
Throughout his career, Sekiguchi has worked with notable companies such as Dexerials Corporation and Sony Chemicals Corporation. His experience in these organizations has contributed to his expertise in developing advanced materials and manufacturing processes for electronic devices.
Collaborations
Sekiguchi has collaborated with talented individuals in the field, including Keisuke Aramaki and Junichiro Sugita. These partnerships have fostered innovation and the exchange of ideas, further enhancing the quality of his inventions.
Conclusion
Morio Sekiguchi's work in smart card technology exemplifies the impact of innovative thinking in the electronics industry. His patents reflect a commitment to improving connection reliability and performance in electronic components.