Tokyo, Japan

Moriaki Akazawa

This inventor holds 1 USPTO granted patent. Top assignee: Nihon Micro Coating Co., Ltd.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Moriaki Akazawa. Retrieved from https://idiyas.com/inventor/moriaki-akazawa-6d032bw1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Innovations by Moriaki Akazawa

Introduction

Moriaki Akazawa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of surface polishing technology. His innovative approach has led to the development of a unique method that enhances the efficiency of polishing processes.

Latest Patents

Moriaki Akazawa holds a patent for a method of polishing a target surface. This invention features a circular polishing pad with grooves formed in a spiral pattern, offset from the center of the pad. The spiral pattern can be either an Archimedean spiral or a parabolic spiral. This method allows for polishing a target object without the need to oscillate the platen or the polishing head that holds the object.

Career Highlights

Moriaki Akazawa is associated with Nihon Micro Coating Co., Ltd., where he applies his expertise in polishing technologies. His work has been instrumental in advancing the capabilities of surface treatment processes.

Collaborations

Moriaki collaborates with Tetsujiro Tada, contributing to the development of innovative solutions in their field.

Conclusion

Moriaki Akazawa's contributions to polishing technology exemplify the impact of innovative thinking in engineering. His patented method showcases a blend of creativity and practicality, paving the way for advancements in surface treatment techniques.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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