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Bayan Baru, Malaysia

Mooi Ling Chang

USPTO Granted Patents = 10 (Patent Applications = 1)

Average Co-Inventor Count = 5.0

ph-index = 2

Forward Citations = 45(Granted Patents)

Location History:

Kedah, MY (2012)
Bayan Lepas, MY (2021)
Bayan Baru, MY (2019 - 2023)

Company Filing History:

10 out of 54,664

Intel Corporation

Years Active: 2012-2025

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12349276 - Co-planar interconnection mechanisms for circuit boards (2025-07-01),

2. 11696409 - Vertical embedded component in a printed circuit board blind hole (2023-07-04),

3. 11121074 - Packaged die stacks with stacked capacitors and methods of assembling same (2021-09-14),

4. 11096284 - Compact semiconductor chip system and method (2021-08-17),

5. 10998261 - Over-molded IC package with in-mold capacitor (2021-05-04),

6. 10593618 - Packaged die stacks with stacked capacitors and methods of assembling same (2020-03-17),

7. 10541200 - Over-molded IC packages with embedded voltage reference plane and heater spreader (2020-01-21),

8. 10515912 - Integrated circuit packages (2019-12-24),

9. 10297541 - Multiple-component substrate for a microelectronic device (2019-05-21),

10. 8228680 - Embedding thin film resistors in substrates in power delivery networks (2012-07-24),

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