Company Filing History:
Years Active: 1985-2000
Title: Mohendra S Bawa: Innovator in Chemical-Mechanical Polishing
Introduction
Mohendra S Bawa is a notable inventor based in Plano, TX (US). He has made significant contributions to the field of chemical-mechanical polishing, holding a total of 6 patents. His work focuses on enhancing the efficiency and effectiveness of polishing slurries used in semiconductor manufacturing.
Latest Patents
Among his latest patents, one is titled "Method for maintaining the buffer capacity of siliceous." This invention outlines a method for maintaining the buffer capacity of a polishing slurry during chemical-mechanical wafer polishing. The method involves circulating the polishing slurry in a polishing apparatus, monitoring its pH, and adjusting the pH to maintain it within a predetermined range. Another significant patent is "Method for producing silicon coating having high surface area." This invention describes a method for producing a high surface substrate by depositing at least two dissimilar materials through a mask onto a substrate, followed by selectively removing one of the materials to achieve a high surface area.
Career Highlights
Mohendra S Bawa is currently employed at Texas Instruments Corporation, where he continues to innovate and contribute to advancements in technology. His expertise in chemical-mechanical polishing has positioned him as a valuable asset in the semiconductor industry.
Collaborations
He has collaborated with notable coworkers, including David E Witter and James K Truitt, who share a commitment to innovation and excellence in their respective fields.
Conclusion
Mohendra S Bawa's contributions to the field of chemical-mechanical polishing through his patents and work at Texas Instruments Corporation highlight his role as a leading inventor. His innovative methods are paving the way for advancements in semiconductor manufacturing.