The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2000

Filed:

Aug. 01, 1997
Applicant:
Inventors:

Mohendra S Bawa, Plano, TX (US);

Vikki Sue Simpson, Sherman, TX (US);

Palmer A Miller, Sherman, TX (US);

Franklin Louis Allen, Sherman, TX (US);

Gary Lee Etheridge, Sherman, TX (US);

Kenneth John L'Anglois, Sherman, TX (US);

Michael H Grimes, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
438692 ; 216 88 ; 216 89 ; 438-5 ; 438 14 ; 438693 ; 451 36 ; 451 41 ; 451287 ; 451288 ;
Abstract

A method for maintaining the buffer capacity of a polishing slurry during chemical-mechanical wafer polishing, the method comprising circulating the polishing slurry in a chemical-mechanical wafer polishing apparatus, monitoring the pH of the polishing slurry, combining an agent into the polishing slurry to adjust the pH of the polishing slurry and maintaining the pH of the polishing slurry within a predetermined range, thereby maintaining the buffer capacity of the polishing slurry.


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