Sherman, TX, United States of America

Kenneth John L'Anglois


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Kenneth John L'Anglois: Innovator in Chemical-Mechanical Polishing

Introduction

Kenneth John L'Anglois is a notable inventor based in Sherman, TX (US). He has made significant contributions to the field of chemical-mechanical polishing, particularly in the maintenance of polishing slurries. His innovative approach has led to advancements in the efficiency and effectiveness of wafer polishing processes.

Latest Patents

Kenneth holds a patent for a method titled "Method for maintaining the buffer capacity of siliceous." This patent describes a process for maintaining the buffer capacity of a polishing slurry during chemical-mechanical wafer polishing. The method involves circulating the polishing slurry in a chemical-mechanical wafer polishing apparatus, monitoring the pH of the slurry, and combining an agent to adjust the pH within a predetermined range. This innovation ensures the optimal performance of the polishing slurry.

Career Highlights

Kenneth is currently employed at Texas Instruments Corporation, where he applies his expertise in chemical-mechanical polishing. His work has contributed to the development of advanced technologies in the semiconductor industry. With a focus on innovation, Kenneth continues to push the boundaries of what is possible in wafer polishing.

Collaborations

Throughout his career, Kenneth has collaborated with talented individuals such as Mohendra S Bawa and Vikki S Simpson. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Kenneth John L'Anglois is a distinguished inventor whose work in chemical-mechanical polishing has made a lasting impact on the industry. His innovative methods and collaborations highlight his commitment to advancing technology in wafer polishing.

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