Sherman, TX, United States of America

Franklin L Allen

This inventor holds 3 USPTO granted patents. Top assignee: Texas Instruments Corporation. Active years: 1995-2000.


% Patents Active = 100.0

Average Co-Inventor Count = 5.8

ph-index = 3

Forward Citations = 73(Granted Patents)


Company Filing History:


Years Active: 1995-2000

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3 patents (USPTO):Explore Patents

Title: Franklin L Allen: Innovator in Semiconductor Polishing Technologies

Introduction

Franklin L Allen is a notable inventor based in Sherman, TX (US). He has made significant contributions to the field of semiconductor polishing technologies, holding a total of 3 patents. His work focuses on improving the efficiency and effectiveness of chemical-mechanical polishing processes.

Latest Patents

Allen's latest patents include a method for maintaining the buffer capacity of siliceous polishing slurries during chemical-mechanical wafer polishing. This method involves circulating the polishing slurry in a polishing apparatus, monitoring its pH, and adjusting it to maintain a predetermined range. Another significant patent is for a method of surface protection of a semiconductor wafer during polishing. This innovation involves applying a protective layer of silicon oxide or silicon nitride to the backside of the wafer, safeguarding it against particles, scratches, and etching.

Career Highlights

Franklin L Allen is currently employed at Texas Instruments Corporation, where he continues to develop innovative solutions in semiconductor technology. His expertise in polishing processes has made him a valuable asset to the company.

Collaborations

Throughout his career, Allen has collaborated with talented individuals such as Vikki S Simpson and William L Smith. These partnerships have contributed to the advancement of his research and innovations.

Conclusion

Franklin L Allen's contributions to semiconductor polishing technologies demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the challenges in wafer polishing and offer practical solutions that enhance the manufacturing process.

Profile summary based on public USPTO records.
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