Texas Instruments Corporation

Mohendra S Bawa

David E Witter

Donald Charles Abbott

Lawrence D Dyer

John Britton Robbins

Franklin L Allen

Vikki S Simpson

James K Truitt

Palmer A Miller

Michael H Grimes

Gary Lee Etheridge

Kenneth John L'Anglois

A method for maintaining the buffer capacity of a polishing slurry during chemical-mechanical wafer polishing, the method comprising circulating the polishing slurry in a chemical-mechanical wafer polishing apparatus, monitoring the pH of the polishing slurry, combining an agent into the polishing slurry to adjust the pH of the polishing slurry and maintaining the pH of the polishing slurry within a predetermined range, thereby maintaining the buffer capacity of the polishing slurry.

Method for maintaining the buffer capacity of siliceous

The invention is to a method for producing a high surface substrate. A mask is positioned (31) over a substrate to define a deposition area. Thereafter at least two dissimilar materials are simultaneously deposited (32) through the mask onto the deposition area. Then one of the deposited materials is selectively removed (33) to provide a high surface area deposited substrate.

Method for producing silicon coating having high surface area

A method of removing impurities from low grade silicon is provided comprising adding a zirconium compound to the low grade silicon for adsorbing the impurities.

Method for silicon purification

Trace quantities of elemental iodine are added to deionized water used in the manufacture of semiconductor materials and devices in order to sterilize the water and the delivery system of microscopic life forms, and to leave the iodine in the flow all the way through processing except for those process steps where iodine may be detrimental to the process step.

Iodine sterilization of deionized water in semiconductor processing

Liquid silicon is deposited on a high surface area column of silicon nitride particles, by hydrogen decomposition of trichlorosilane. This is accomplished in an environment heated to a temperature in excess of the melting point of silicon. After deposition, the liquid silicon flows by gravity to a collection point. Preferably a liquid transfer system moves the silicon directly to a crystal pulling operation. The liquid transfer to immediate pulling conserves energy and allows for continual withdrawal of melt from the reactor. The immediate pulling provides additional purification and the crystal thus pulled is preferably used as feedstock for a final crystal pulling operation.

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Plano, TX, United States of America

Mohendra S Bawa