This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Canada Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Mohammad Shafayet Zamil and Integrated Circuit Packaging
Introduction
Mohammad Shafayet Zamil is an inventor based in Nepean, Canada, associated with Infineon Technologies Canada Inc. His work includes an invention for packaging integrated circuit dies.
Latest Patents
Zamil is credited with 1 patent: “Leaded Package Using Routing Layer for Integrated Circuit Die.” The invention places a routing layer between an integrated circuit die and the package contacts. The layer electrically connects the die contacts to the package contacts, allowing their layouts to differ. This arrangement can support a compact package and enable a common package-contact layout to accommodate chips with different die-contact layouts.
Career Highlights
Zamil’s listed patent reflects work on integrated circuit packaging and the electrical connections between a chip and its package. He is associated with Infineon Technologies Canada Inc.
Collaborations
His listed coworkers include Mihalis Michael and Farzin Najafi.
Conclusion
Mohammad Shafayet Zamil’s patent addresses a flexible, compact approach to connecting integrated circuit dies with package contacts.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile