Leaded package using routing layer for integrated circuit die

Abstract

A package for an integrated circuit die (e.g., a chip). A routing layer is layered between the chip and package contacts of the package. The chip has a planar surface along which the chip includes die contacts. The routing layer lies along the planar surface of the chip, and electrically connects the die contacts of the chip to the package contacts of the package. This allows the chip, the routing layer, and the package contacts to be stacked together to form a relatively thin, compact package. The routing layer connects the die contacts of the chip to the package contacts of the package, such that the die contacts need not have the same layout as the package contacts, thus allowing packages with the same package contact layouts to be used to package chips with varying die contact layouts. A lead in conductive contact with the package contact.