This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Canada Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Mihalis Michael: Inventor of a Compact Integrated Circuit Package
Introduction
Mihalis Michael is an inventor associated with San Jose, California, and Infineon Technologies Canada Inc. His work includes an invention focused on making integrated circuit packages thinner and more adaptable to different chip layouts.
Latest Patents
Michael is credited with 1 patent: “Leaded Package Using Routing Layer for Integrated Circuit Die.” The invention places a routing layer between an integrated circuit die and the package contacts. The layer electrically connects the die contacts to the package contacts, allowing the components to be stacked into a compact package. It also enables chips with different die-contact layouts to use packages with the same package-contact layout. A lead is in conductive contact with a package contact.
Career Highlights
Michael’s listed patent reflects work on integrated circuit packaging and electrical interconnections. His company affiliation is Infineon Technologies Canada Inc.
Collaborations
His listed coworkers include Farzin Najafi and Mohammad Shafayet Zamil.
Conclusion
Mihalis Michael’s patent describes a routing-layer approach that supports compact integrated circuit packages while accommodating variation in chip contact layouts.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile