Mohammad Mamunur Rahman

Title: Innovations by Mohammad Mamunur Rahman

Introduction

Mohammad Mamunur Rahman is an accomplished inventor based in Gilbert, AZ (US). He has made significant contributions to the field of electronic device packaging, holding 3 patents that showcase his innovative approach to technology.

Latest Patents

His latest patents include "Structural elements for application specific electronic device packages" and "Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package." The first patent describes an integrated circuit package that features an integral structural member embedded within dielectric material. This design enhances the stiffness of the package without increasing its z-height. The structural member consists of intersecting elements, which may include conductive vias that are non-orthogonal to the package plane. This allows for adjustments in rigidity based on specific application needs. The second patent outlines a semiconductor package that incorporates first and second waveguides, each with angled conductive layers and transmission lines. This innovative design aims to improve the functionality and efficiency of semiconductor packages.

Career Highlights

Mohammad currently works at Intel Corporation, where he continues to push the boundaries of technology through his inventive work. His contributions have been instrumental in advancing the capabilities of electronic devices.

Collaborations

He collaborates with talented coworkers, including Suddhasattwa Nad and Brandon C Marin, who contribute to the innovative environment at Intel Corporation.

Conclusion

Mohammad Mamunur Rahman's work exemplifies the spirit of innovation in the field of electronic device packaging. His patents reflect a deep understanding of technology and a commitment to enhancing device performance.