Company Filing History:
Years Active: 1989-1990
Title: Innovations of Mohammad Farnaam
Introduction
Mohammad Farnaam is a notable inventor based in Santa Clara, California. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on improving interconnect systems and contact formations in semiconductor devices.
Latest Patents
One of his latest patents involves creating a high-speed interconnect system with refractory non-dogbone. This innovative interconnect features interlevel contacts that utilize refractory materials to enhance performance. The design includes patterned refractory core portions made of tungsten or molybdenum, which are equipped with sidewall spacers of aluminum, gold, or copper. This configuration not only reduces electrical resistivity but also mitigates electromigration failure modes, ensuring reliable performance in semiconductor applications.
Another significant patent by Farnaam describes a stable, low-resistance contact formed in a contact hole through an insulating layer on a semiconductor substrate. This contact comprises an adhesion and contacting layer of titanium, a barrier layer, and a conductive material that fills the contact hole. The design addresses common issues such as encroachment at the oxide-silicon interface while maintaining process simplicity.
Career Highlights
Farnaam is currently employed at Advanced Micro Devices Corporation, where he continues to innovate in the semiconductor industry. His expertise in interconnect systems and contact formations has positioned him as a valuable asset to his team.
Collaborations
Throughout his career, Farnaam has collaborated with notable colleagues, including Jack Sliwa and Pankaj Dixit. These partnerships have contributed to the advancement of technology in their field.
Conclusion
Mohammad Farnaam's contributions to semiconductor technology through his patents and work at Advanced Micro Devices Corporation highlight his role as an influential inventor. His innovative approaches to interconnect systems and contact formations continue to shape the future of the industry.