Mahopac, NY, United States of America

Modest M Oprysko


Average Co-Inventor Count = 4.3

ph-index = 15

Forward Citations = 603(Granted Patents)


Location History:

  • Mahopac, NY (US) (1990 - 2003)
  • Carmel, NY (US) (2001 - 2006)

Company Filing History:


Years Active: 1990-2006

where 'Filed Patents' based on already Granted Patents

22 patents (USPTO):

Title: Modest M Oprysko: Innovator in Electrical Interconnects

Introduction

Modest M Oprysko is a prominent inventor based in Mahopac, NY, with a remarkable portfolio of 22 patents. He has made significant contributions in the field of electrical interconnect technology, particularly through his work at International Business Machines Corporation (IBM). His innovative spirit has led to advancements that improve electrical performance and efficiency in integrated circuit arrangements.

Latest Patents

Among his latest inventions, Oprysko has patented groundbreaking technologies in impedance matching and electrical interconnects. One of his notable patents, "Via and via landing structures for smoothing transitions in multi-layer substrates," describes an integrated circuit arrangement that incorporates contact pads and a multi-layer conductive structure. This innovative design enhances impedance matching between the contact pads and signal lines, resulting in better electrical performance.

Another significant patent, "Impedance matched electrical interconnect using dielectric compounds," focuses on creating an improved electrical interconnect. This invention involves applying a dielectric material with a controllable characteristic to the interconnect, allowing for selective adjustment of the impedance. This advanced technique minimizes electrical discontinuities, thereby enhancing overall electrical performance.

Career Highlights

Modest M Oprysko has dedicated his career to the field of electrical engineering, where he has demonstrated a commitment to innovation and excellence. His tenure at IBM has allowed him to collaborate with some of the brightest minds in the industry, contributing to the advancement of technology and setting new standards for electrical interconnect solutions.

Collaborations

Throughout his career, Oprysko has had the privilege of working alongside esteemed colleagues, including Michael Frank Cina and Jeannine Madelyn Trewhella. These collaborations have fostered an environment of creativity and innovation, enabling the development of cutting-edge technologies that are critical to the advancement of electronic devices.

Conclusion

Modest M Oprysko's contributions to the field of electrical interconnects are substantial and far-reaching. With 22 patents to his name and a strong professional presence at IBM, he continues to push the boundaries of innovation. His latest inventions reflect a deep understanding of electrical engineering principles and a passion for enhancing technology, paving the way for future advancements in the industry.

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