This inventor holds 2 USPTO granted patents. Top assignees: Sony Chemical & Information Device Corporation, Tessera Interconnect Materials, Inc.. Active years: 2011-2012.
Company Filing History:
2 out of 122 
1 out of 9 Years Active: 2011-2012
Title: Mitsuyuki Takayasu: Innovator in Multilayer Wiring Board Technology
Introduction
Mitsuyuki Takayasu is a prominent inventor based in Ishikawa, Japan. He has made significant contributions to the field of multilayer wiring board technology, holding a total of 2 patents. His innovative approaches have enhanced the manufacturing processes and reliability of electronic components.
Latest Patents
Takayasu's latest patents include a method for manufacturing multilayer wiring boards. This process involves forming an insulating layer on a base with a bump for interlayer connection. It also includes bonding a copper foil onto the insulating layer through thermocompression bonding, using stainless steel plates. A metal foil is interposed between the stainless plates and the copper foil during bonding, with a mold release layer formed on the metal foil's surface. This method prevents sticking of the product after molding and ensures dimensional stability without wrinkling or ruggedness. Another patent focuses on a multilayer printed circuit board, where a copper foil is bonded to an insulating layer with a buried bump for interlayer connection. The copper foil features an oxide film that enhances electrical connection reliability while maintaining mechanical strength.
Career Highlights
Throughout his career, Takayasu has worked with notable companies such as Sony Chemical & Information Device Corporation and Tessera Interconnect Materials, Inc. His experience in these organizations has contributed to his expertise in the field of electronic materials and manufacturing processes.
Collaborations
Some of his notable coworkers include Kazuhiro Shimizu and Kiyoe Nagai. Their collaborative efforts have likely played a role in advancing the technologies associated with multilayer wiring boards.
Conclusion
Mitsuyuki Takayasu's contributions to multilayer wiring board technology have established him as a key figure in the field. His innovative patents and career experiences reflect his commitment to enhancing electronic manufacturing processes.