The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2012
Filed:
Sep. 29, 2005
Kazuhiro Shimizu, Ishikawa, JP;
Masanobu Yagi, Ishikawa, JP;
Kenichiro Hanamura, Ishikawa, JP;
Mitsuyuki Takayasu, Ishikawa, JP;
Kiyoe Nagai, Ishikawa, JP;
Tomoo Iijima, Tokyo, JP;
Kazuhiro Shimizu, Ishikawa, JP;
Masanobu Yagi, Ishikawa, JP;
Kenichiro Hanamura, Ishikawa, JP;
Mitsuyuki Takayasu, Ishikawa, JP;
Kiyoe Nagai, Ishikawa, JP;
Tomoo Iijima, Tokyo, JP;
Tessera Interconnect Materials, Inc., San Jose, CA (US);
Abstract
A process for manufacturing a multilayer wiring board including the steps of forming an insulating layer on a base provided with a bump for interlayer connection, bonding a copper foil onto the insulating layer by a thermocompression bonding by sandwiching the copper foil between stainless steel plates, and patterning the copper foil, in which a metal foil is interposed at least between each of the stainless plates and the copper foil at the time of the thermocompression bonding. At this time, a mold release layer is formed on a surface of the metal foil to be imposed. Thus, such a multilayer wiring board can be manufactured that prevents sticking of a product after molding (cementing of the copper foil) and excels in dimensional stability without occurrence of wrinkling and ruggedness.