This inventor holds 2 USPTO granted patents. Top assignees: Sony Chemical & Information Device Corporation, Tessera Interconnect Materials, Inc.. Active years: 2011-2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
2 out of 122 
1 out of 9 Years Active: 2011-2012
Title: Kiyoe Nagai: Innovator in Multilayer Wiring Board Technology
Introduction
Kiyoe Nagai is a prominent inventor based in Ishikawa, Japan. She has made significant contributions to the field of multilayer wiring board technology, holding 2 patents that showcase her innovative approach to manufacturing processes.
Latest Patents
One of her latest patents is a method for manufacturing a multilayer wiring board. This process includes forming an insulating layer on a base with a bump for interlayer connection, bonding a copper foil onto the insulating layer through thermocompression bonding, and patterning the copper foil. A metal foil is interposed between the stainless steel plates and the copper foil during bonding, with a mold release layer formed on the metal foil's surface. This method effectively prevents sticking of the product after molding and enhances dimensional stability without wrinkling or ruggedness.
Another notable patent is for a multilayer printed circuit board and its manufacturing method. In this invention, a copper foil is bonded to an insulating layer with a buried bump for interlayer connection. The copper foil is treated to ensure reliable electrical connection with the bump while maintaining sufficient mechanical strength with the insulating layer. This innovation significantly improves the reliability of electrical connections in multilayer wiring boards.
Career Highlights
Kiyoe Nagai has worked with notable companies such as Sony Chemical & Information Device Corporation and Tessera Interconnect Materials, Inc. Her experience in these organizations has contributed to her expertise in the field of electronic materials and manufacturing processes.
Collaborations
Throughout her career, Kiyoe has collaborated with talented individuals, including Kazuhiro Shimizu and Mitsuyuki Takayasu. These collaborations have further enriched her work and innovations in multilayer wiring technology.
Conclusion
Kiyoe Nagai's contributions to multilayer wiring board technology reflect her dedication to innovation and excellence. Her patents demonstrate her ability to solve complex manufacturing challenges, making her a significant figure in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile