Mitsuru Usui

Title: Mitsuru Usui: Innovator in Multilayer Wiring Technology

Introduction

Mitsuru Usui is a prominent inventor based in Hadano, Japan. He has made significant contributions to the field of electronic components, particularly in the manufacturing of multilayer wiring boards. With a total of 3 patents to his name, Usui's work has advanced the technology used in electronic parts.

Latest Patents

Usui's latest patents include a method for the manufacture of multilayer wiring boards and a process for producing electronic parts. The multilayer wiring board patent describes a substrate with multiple layers of wiring or insulation film formed from different materials. This innovative design improves the coverage of films applied to the board. The process involves forming an insulation film on a substrate, followed by the continuous formation of resistor films and electrodes, which are then etched to create a stepwise patterned side face. The electronic part patent outlines a method for producing an electronic component by layering two metallic wiring films of different materials on a main substrate, with a protective film in between to safeguard against etching and corrosion.

Career Highlights

Mitsuru Usui is currently employed at Hitachi, Ltd., where he continues to develop cutting-edge technologies in the electronics sector. His work has been instrumental in enhancing the performance and reliability of electronic components.

Collaborations

Usui has collaborated with notable colleagues, including Tetsuya Watanabe and Minoru Yamada. Their combined expertise has contributed to the successful development of innovative technologies in their field.

Conclusion

Mitsuru Usui's contributions to multilayer wiring technology and electronic components have established him as a key figure in the industry. His patents reflect a commitment to innovation and excellence in engineering.