The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 1996
Filed:
Jan. 20, 1995
Applicant:
Inventors:
Assignee:
Hitachi, Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B / ; B44C / ; C23F / ;
U.S. Cl.
CPC ...
216 18 ; 216 39 ; 216 41 ; 257759 ;
Abstract
An electronic part is produced by forming two metallic wiring films of different materials on a main substrate, where a first metallic wiring film is formed on the main substrate, a protective film is formed in desired regions on the main substrate and the first metallic wiring film, and a second metallic wiring film is formed on the first metallic wiring film. The thus produced electronic part has an insulating protective film between the first and second metallic wiring films. By the presence of the protective film the surface of the first metallic wiring film is protected from etching, corrosion or deterioration by an agent for patterning the second metallic wiring film.