Mitsuru Akagawa

Title: Mitsuru Akagawa: Innovator in Microencapsulation Technology

Introduction

Mitsuru Akagawa is a notable inventor based in Ibaraki, Japan. He has made significant contributions to the field of materials science, particularly in the development of microencapsulated curing agents. With a total of three patents to his name, Akagawa's work is recognized for its innovative approach to enhancing thermosetting resins.

Latest Patents

One of Akagawa's latest patents is for a microencapsulated curing agent designed for use in curing thermosetting resins. This microencapsulated curing agent consists of an organic peroxide curing agent encapsulated within a polyurethane resin. When subjected to heat, specifically at 100°C for 30 minutes, it demonstrates a weight loss of no more than 10 wt.%. Additionally, when heated to 140°C for 5 minutes, it shows a weight loss of at least 4 wt.%. Another significant patent involves a fiber reinforced resin molding compound and the manufacturing method for fiber reinforced resin molded articles. This molding compound includes a resin composition and reinforcing fibers, with the resin composition containing an unsaturated polyester resin, a microencapsulated curing agent, and a non-microencapsulated curing agent.

Career Highlights

Mitsuru Akagawa is currently associated with Ocv Intellectual Capital, LLC, where he continues to innovate and develop new materials. His expertise in microencapsulation technology has positioned him as a key figure in the advancement of resin applications.

Collaborations

Akagawa collaborates with Takuya Yasuhara, contributing to the development of innovative solutions in their field. Their partnership exemplifies the importance of teamwork in driving technological advancements.

Conclusion

Mitsuru Akagawa's contributions to microencapsulation technology and resin applications highlight his role as a leading inventor in the industry. His patents reflect a commitment to innovation and the advancement of materials science.