The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Dec. 06, 2012
Applicant:
Ocv Intellectual Capital, Llc, Toledo, OH (US);
Inventor:
Mitsuru Akagawa, Ibaraki, JP;
Assignee:
OCV Intellectual Capital, LLC, Toledo, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 7/14 (2006.01); C08K 9/10 (2006.01); C08K 7/02 (2006.01); C08J 3/24 (2006.01); C08J 5/04 (2006.01); C08K 7/06 (2006.01); C08K 5/00 (2006.01); C08K 5/14 (2006.01);
U.S. Cl.
CPC ...
C08K 7/14 (2013.01); C08J 3/241 (2013.01); C08J 3/243 (2013.01); C08J 5/04 (2013.01); C08J 5/042 (2013.01); C08J 5/043 (2013.01); C08K 7/02 (2013.01); C08K 7/06 (2013.01); C08J 2333/06 (2013.01); C08J 2367/06 (2013.01); C08K 5/0025 (2013.01); C08K 5/14 (2013.01); C08K 9/10 (2013.01);
Abstract
A molding compound for manufacturing a fiber reinforced molded article is provided. The molding compound includes a resin composition and reinforcing fibers, with the resin composition containing an unsaturated polyester resin, a microencapsulated curing agent and a non-microencapsulated curing agent.