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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9725575 B1

PDFFull Text
Date of Patent:
Aug. 08, 2017

Filed:

Mar. 14, 2014

Microencapsulated curing agent

Applicant:

Ocv Intellectual Capital, Llc, Toledo, OH (US);

Inventors:

Mitsuru Akagawa, Ibaraki, JP;

Takuya Yasuhara, Takuya, JP;

Assignee:

OCV Intellectual Capital, LLC, Toledo, OH (US);

Attorney:

Calfee, Halter & Griswold LLP

Primary Examiner:

Jeffrey Washville

Int. Cl.
CPC ...
C08K 5/14 (2006.01); B01J 13/16 (2006.01); C08G 18/08 (2006.01); C08G 18/32 (2006.01); C08G 18/48 (2006.01); C08G 18/76 (2006.01); C08J 3/24 (2006.01); C08L 67/06 (2006.01); B29C 45/00 (2006.01); C08K 5/00 (2006.01); C08K 9/10 (2006.01); C08L 25/06 (2006.01);
U.S. Cl.
CPC ...
C08K 5/14 (2013.01); B01J 13/16 (2013.01); B29C 45/0001 (2013.01); C08G 18/0866 (2013.01); C08G 18/3228 (2013.01); C08G 18/4833 (2013.01); C08G 18/7642 (2013.01); C08J 3/241 (2013.01); C08L 67/06 (2013.01); C08K 5/0025 (2013.01); C08K 9/10 (2013.01); C08L 25/06 (2013.01);
Abstract

A microencapsulated curing agent for use in curing a thermosetting resin is provided. The microencapsulated curing agent includes an organic peroxide curing agent and a polyurethane resin encapsulating the organic peroxide curing agent. The microencapsulated curing agent, when heated to 100° C. for 30 minutes, exhibits a loss of weight of no greater than 10 wt. %. Additionally, when heated to 140° C. for 5 minutes, the microencapsulated curing agent exhibits a loss of weight of at least 4 wt. %.

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Akagawa, Mitsuru. (2017). Microencapsulated curing agent (U.S. Patent No. 9725575). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9725575

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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