This inventor holds 6 USPTO granted patents and 2 published patent applications. Top assignee: Tdk Corporation. Active years: 2020-2026.
Company Filing History:
Years Active: 2020-2026
Title: Mitsuo Natori: Innovator in Coil Component Technology
Introduction
Mitsuo Natori is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of coil component technology, holding a total of 6 patents. His innovative designs focus on enhancing the performance and efficiency of coil components.
Latest Patents
One of Natori's latest patents is for a coil component and manufacturing method that achieves a high inductance value while reducing the overall thickness. This invention features a coil part with interlayer insulating films and spirally wound coil patterns stacked in the axial direction. The design incorporates magnetic element members that embed the coil part. Notably, the interlayer insulating film covering one end of the coil pattern is made of a material with higher permeability, allowing for improved inductance without increasing thickness. Another patent discloses a coil component comprising multiple conductor layers, where first, second, third, and fourth conductor layers are stacked. The design includes planar spiral coils with varying pattern widths, optimizing the performance of the coil component.
Career Highlights
Mitsuo Natori is associated with TDK Corporation, a leading company in electronic components. His work has significantly impacted the development of advanced coil technologies, contributing to the company's reputation for innovation in the electronics industry.
Collaborations
Natori has collaborated with notable colleagues, including Tomonaga Nishikawa and Kouji Kawamura. Their combined expertise has fostered advancements in coil component design and manufacturing.
Conclusion
Mitsuo Natori's contributions to coil component technology exemplify his innovative spirit and dedication to enhancing electronic components. His patents reflect a commitment to improving performance while addressing design challenges.