The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Feb. 10, 2021
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuuichi Kawaguchi, Tokyo, JP;

Tomonaga Nishikawa, Tokyo, JP;

Takuya Takeuchi, Tokyo, JP;

Mitsuo Natori, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 17/04 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/32 (2013.01); H01F 17/04 (2013.01); H01F 41/04 (2013.01);
Abstract

To achieve a high inductance value while reducing the entire thickness in a coil component having a structure in which spiral coil patterns are stacked. A coil component includes: a coil part having a structure in which interlayer insulating films and spirally wound coil patterns are alternately stacked in the axial direction of the coil component; and magnetic element members embedding therein the coil part. The interlayer insulating film covering, from one end side in the axial direction, one coil pattern positioned at the one end in the axial direction is higher in permeability than the interlayer insulating films. Thus, the one coil pattern positioned at the end portion is covered with the interlayer insulating film having a high permeability, so that it is possible to achieve a high inductance value while reducing the entire thickness.


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