Osaka, Japan

Mitsuo Kuramoto

This inventor holds 9 USPTO granted patents. Top assignees: Nitto-Denko Corporation, Tohoku Ricoh Co., Ltd.. Active years: 1990-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mitsuo Kuramoto. Retrieved from https://idiyas.com/inventor/mitsuo-kuramoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.1

ph-index = 5

Forward Citations = 93(Granted Patents)


Location History:

  • Osaka-fu, JP (1996)
  • Osaka, JP (1990 - 2002)

Company Filing History:


Years Active: 1990-2002

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9 patents (USPTO):Explore Patents

Title: Mitsuo Kuramoto: Innovator in Adhesive Technologies

Introduction

Mitsuo Kuramoto is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of adhesive technologies, holding a total of 9 patents. His innovative work has had a lasting impact on various industries.

Latest Patents

Among his latest patents are the "Printable pressure-sensitive adhesive sheet and sealing material containing same" and the "Sheet for forming burned pattern." These inventions showcase his expertise in developing advanced materials that enhance product functionality.

Career Highlights

Mitsuo Kuramoto has had a distinguished career, working with notable companies such as Nitto Denko Corporation and Tohoku Ricoh Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking projects.

Collaborations

Throughout his career, Kuramoto has collaborated with talented individuals, including Katsuya Kume and Itsuroh Takenoshita. These partnerships have fostered innovation and led to the successful development of new technologies.

Conclusion

Mitsuo Kuramoto's contributions to adhesive technologies and his impressive portfolio of patents highlight his role as a key innovator in the field. His work continues to influence advancements in material science and engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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