This inventor holds 1 USPTO granted patent. Top assignee: Kabushiki Kaisha Shinkawa. Active years: 1999.
Company Filing History:
Years Active: 1999
Title: Mitsuo Kosuda: Innovator in Lead Frame Technology
Introduction
Mitsuo Kosuda is a notable inventor based in Fussa, Japan. He has made significant contributions to the field of lead frame technology, particularly with his innovative patent that enhances the efficiency of wire bonding apparatuses.
Latest Patents
Mitsuo Kosuda holds a patent for a lead frame separating and conveying apparatus. This device is designed to work with wire bonding apparatuses and features a frame separating assembly that includes frame guides. These guides support lead frames aligned with flat surfaces in a vertical direction. The apparatus also includes frame suspension guides installed above the front ends of the frame guides, facilitating the feeding direction of the lead frames. A frame pusher is incorporated to push the rear end of the lead frames, allowing for smooth conveyance onto the frame suspension guides. The frame suspension guides support the lead frames in a suspended manner and have frame separating sections that are inclined upward.
Career Highlights
Mitsuo Kosuda is associated with Kabushiki Kaisha Shinkawa, where he has applied his expertise in lead frame technology. His work has contributed to advancements in manufacturing processes, particularly in the electronics industry.
Collaborations
Mitsuo has collaborated with notable coworkers, including Yuji Tanaka and Eiichi Shimazaki. Their combined efforts have fostered innovation and development within their field.
Conclusion
Mitsuo Kosuda's contributions to lead frame technology exemplify the impact of innovative thinking in engineering. His patent for the lead frame separating and conveying apparatus showcases his commitment to enhancing manufacturing efficiency.