Chiba, Japan

Mitsuo Akiba

This inventor holds 2 USPTO granted patents. Top assignees: Seiko Instruments Inc, Kaga, Inc.. Active years: 2010-2016.


% Patents Active = 50.0

Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2010-2016

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2 patents (USPTO):Explore Patents

Title: Mitsuo Akiba: Innovator in Electronic Device Packaging

Introduction

Mitsuo Akiba is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of electronic device packaging, holding a total of 2 patents. His work focuses on improving the efficiency and functionality of electronic devices.

Latest Patents

Mitsuo Akiba's latest patents include a lid body portion and an electronic device package utilizing this lid body portion. The aim of this invention is to provide a lid body portion with an enhanced mounting ratio for electronic device components. The design features a concave portion that creates a space formed by a bottom and side plate, along with a flange extending from the outer edge of the opening. This innovative structure allows for better integration of electronic components. Another patent involves a method for fabricating a hermetic terminal and piezoelectric oscillators. This method includes steps for plating a hermetic terminal intermediate and sealing a piezoelectric vibrating piece within a case, ensuring reliable performance in electronic applications.

Career Highlights

Throughout his career, Mitsuo Akiba has worked with reputable companies such as Seiko Instruments Inc. and Kaga, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in electronic device technology.

Collaborations

Mitsuo has collaborated with talented individuals in his field, including Hitoshi Takeuchi and Kenji Takano. These partnerships have contributed to the advancement of his projects and the successful development of his patents.

Conclusion

Mitsuo Akiba is a distinguished inventor whose work in electronic device packaging has led to significant advancements in the industry. His innovative patents and collaborations reflect his commitment to enhancing technology in this field.

Profile summary based on public USPTO records.
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