Seiko Instruments Inc

Kaga, Inc.

Mitsuo Akiba

Hitoshi Takeuchi

Shuhei Kaneko

Sadao Oku

Kenji Takano

Masayuki Satoh

To provide a lid body portion with an improved mounting ratio of an electronic device component, an electronic device package and an electronic device including the same. There is provided a lid body portion including a concave portion in which a space portion is formed by a bottom portion and a side plate portion and a flange portion extending from an outer edge portion in an opening portion of the concave portion to the outside, in which a side-plate inner surface as a surface facing the space portion of the concave portion in the side plate portion inclines to the outside of the space portion.

Lid body portion and electronic device package using the lid body portion and electronic device

A method of fabricating a hermetic terminal having an annular ring, a lead arranged to penetrate through the ring in which one end side thereof is an inner lead portion electrically connected to a piezoelectric vibrating piece and the other end side thereof is an outer lead portion electrically connected to outside as the ring is between them, and a filler fixing the lead to the ring, wherein the hermetic terminal seals the piezoelectric vibrating piece inside a case, the method includes the steps of: applying plating to a hermetic terminal intermediate having the lead fixed in the ring with the filler to plate the ring and the lead; setting the hermetic terminal intermediate after subjected to plating on a holding member; and flattening an end part of an inner lead portion in the lead to form a stair portion in the hermetic terminal intermediate set on the holding member.

Method of fabricating hermetic terminal and hermetic terminal, method of fabricating piezoelectric oscillator and piezoelectric oscillator, oscillator, electronic appliance, and radio clock

Growing community of inventors

Chiba, Japan

Mitsuo Akiba