Okayama, Japan

Mitsuharu Uesaka

This inventor holds 1 USPTO granted patent. Top assignee: Kuraray Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mitsuharu Uesaka. Retrieved from https://idiyas.com/inventor/mitsuharu-uesaka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Mitsuharu Uesaka: Inventor of a Full-Grain Leather-Like Sheet.

Introduction

Mitsuharu Uesaka is an inventor associated with Kuraray Co., Ltd. in Okayama, Japan. His patent work includes a leather-like sheet designed to combine a grain-finished appearance with specified surface properties.

Latest Patents

Uesaka is credited with 1 patent, titled “Full-grain leather-like sheet.” The invention describes a grain-finished leather-like sheet with a fiber substrate and a resin layer stacked on one side. The resin layer includes a skin layer containing polyurethane, a nonionic compound with an HLB value of 10 to 16, and a water-soluble polymer. The skin layer is specified to have polar and dispersive components of surface free energy within stated ranges, analyzed using the OWRK method.

Career Highlights

Uesaka’s listed patent reflects work on material design, particularly the composition and surface characteristics of leather-like sheets. His company affiliation connects this work with Kuraray Co., Ltd.

Collaborations

Uesaka’s listed coworkers include Masato Warita and Yohei Takatori.

Conclusion

Mitsuharu Uesaka’s patent focuses on engineering a grain-finished leather-like material through a defined fiber substrate, resin-layer structure, and skin-layer composition.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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