Gunma, Japan

Mitsugu Koike

This inventor holds 1 USPTO granted patent. Top assignee: Lintec Corporation. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mitsugu Koike. Retrieved from https://idiyas.com/inventor/mitsugu-koike-434o8d26

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2001

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Mitsugu Koike: Innovator in Semiconductor Processing

Introduction

Mitsugu Koike is a notable inventor based in Gunma-ken, Japan. He has made significant contributions to the field of semiconductor processing through his innovative designs and patents. His work has had a lasting impact on the industry, particularly in the development of adhesive materials.

Latest Patents

Mitsugu Koike holds a patent for an adhesive sheet specifically designed for semiconductor wafer processing. This adhesive sheet consists of a release liner, an adhesive layer, and a base film, all laminated in a specific order. The design features a great length and is folded in a zigzag manner into equal sections, allowing one section to be superposed exactly upon another. This innovation enhances the efficiency and effectiveness of semiconductor manufacturing processes.

Career Highlights

Koike is currently employed at Lintec Corporation, where he continues to develop advanced materials for various applications. His expertise in adhesive technologies has positioned him as a key player in the field, contributing to the company's reputation for innovation and quality.

Collaborations

Mitsugu Koike has worked alongside talented colleagues, including Masatoshi Matsumoto and Hitoshi Maruhashi. Their collaborative efforts have led to advancements in adhesive technologies and have further strengthened the research and development capabilities at Lintec Corporation.

Conclusion

Mitsugu Koike's contributions to semiconductor processing through his innovative adhesive sheet patent exemplify his dedication to advancing technology in the industry. His work continues to influence the field, showcasing the importance of innovation in driving progress.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…