Fujimi, Japan

Misaichi Takeuchi

This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Misaichi Takeuchi. Retrieved from https://idiyas.com/inventor/misaichi-takeuchi-tn4wpwn5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 17(Granted Patents)


Company Filing History:

goldMedal1 out of 834,601 
Other
 patents

Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Misaichi Takeuchi: Semiconductor-Layer Formation

Introduction

Misaichi Takeuchi is an inventor associated with Fujimi, Japan. His work includes a patented method for forming semiconductor layers, with an emphasis on reducing structural defects and improving manufacturing efficiency.

Latest Patents

The available information lists 1 patent for Takeuchi: “Method for the Formation of Semiconductor Layer.” The method supplies a structural-defect-suppressing material onto the surface of a material layer from which a semiconductor layer is formed. Its stated aim is to reduce defects, particularly threading dislocations, in the resulting layer. By reducing defect density without requiring a complicated process, the method may also shorten processing time and lower manufacturing costs.

Career Highlights

Takeuchi’s listed patent focuses on a practical challenge in semiconductor manufacturing: limiting defects in formed layers. The described approach seeks to achieve this through the application of a defect-suppressing material during layer formation.

Collaborations

Satoru Tanaka and Yoshinobu Aoyagi are identified as Takeuchi’s coworkers. The available information does not specify their roles in the patent or the extent of their collaboration.

Conclusion

Misaichi Takeuchi’s listed invention addresses semiconductor-layer quality by targeting structural defects while aiming to simplify processing, reduce work time, and lower manufacturing costs.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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