Mirng-Ji Lii

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Title: The Innovative Work of Inventor Mirng-Ji Lii

Introduction:

Mirng-Ji Lii is a prolific inventor based in Chandler, Arizona, with a total of six patents to his name. His groundbreaking work in the field of integrated circuit packages has significantly advanced the technological landscape.

Latest Patents:

Lii's most recent patents include an integrated circuit package with surface mounted pins on an organic substrate, utilizing a Sn-Sb solder composition with specific percentages to ensure durability and integrity. This innovation allows the pins to withstand assembly processes without compromising their quality, setting a new standard in the industry.

Career Highlights:

Mirng-Ji Lii is a valued member of Intel Corporation, where his expertise and ingenuity have contributed to cutting-edge developments in integrated circuits. His commitment to innovation and problem-solving has led to the successful implementation of novel technologies in the semiconductor industry.

Collaborations:

Lii has collaborated closely with esteemed coworkers such as Ravi V Mahajan and Hwai-Peng Yeoh, synergizing their skills to drive forward-thinking projects at Intel Corporation. Their combined efforts have resulted in the creation of groundbreaking solutions that have reshaped the field of integrated circuit packaging.

Conclusion:

Inventor Mirng-Ji Lii stands as a visionary in the realm of integrated circuit technologies, with a remarkable portfolio of patents that demonstrate his dedication to excellence and innovation. His contributions have not only propelled Intel Corporation to new heights but have also left a lasting impact on the broader semiconductor industry.

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