The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 1999
Filed:
Dec. 10, 1997
Applicant:
Inventors:
Mirng-Ji Lii, Chandler, AZ (US);
George F Raiser, Chandler, AZ (US);
Ravi V Mahajan, Tempe, AZ (US);
Brad Menzies, Tempe, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257701 ; 257737 ; 257778 ;
Abstract
According to one aspect of the invention there is provided a semiconductor chip comprising a semiconductor die, an array of electrical contacts on an integrated circuit in a frontside of the die, and a protective layer on a backside of the die.
Lii, Mirng-Ji. (1999). C4 package die backside coating (U.S. Patent No. 5936304). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5936304
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile