Mirng Ji Lii

Title: **Mirng Ji Lii: Innovator in Wafer Level IC Assembly**

Introduction

Mirng Ji Lii, based in Hsinchu County, Taiwan, is an accomplished inventor renowned for his contributions to integrated circuit technology. With two patents to his name, Lii's work has significantly impacted the semiconductor manufacturing industry, showcasing his expertise and innovative capabilities.

Latest Patents

Lii's most recent invention is a wafer-level integrated circuit assembly method. This method begins with a mother device wafer featuring multiple first posts made of copper for electrical connections. Solder is sequentially formed on these first posts, ideally pre-formed on a wafer. The placement of solder corresponds precisely with the first posts of the mother device wafer. Subsequently, plural dies containing second posts that correspond to the first posts are carefully placed onto the mother device wafer. The final step involves reflowing the solder to create a secure bond between the first and second posts, with the mother device wafer then diced into individual components. This method enhances the efficiency and reliability of IC assembly processes.

Career Highlights

Mirng Ji Lii is currently employed at Taiwan Semiconductor Manufacturing Company Limited. His work at this leading semiconductor manufacturer has allowed him to apply his innovative ideas in real-world applications, contributing to cutting-edge developments in the industry.

Collaborations

Throughout his career, Lii has collaborated with notable colleagues such as Chien Hsiun Lee and Clinton Chao. These collaborations have fostered a collective approach to innovation, driving advancements in semiconductor technology.

Conclusion

Mirng Ji Lii’s contributions to wafer-level integrated circuit assembly underline the importance of innovation in the rapidly evolving semiconductor industry. His patents and collaborative efforts continue to influence the field, marking him as a vital player in advancing integrated circuit technology.