Minyu Zeng

Title: Minyu Zeng and a Silica–MOF Composite for High-Frequency Electronics.

Introduction

Minyu Zeng is an inventor associated with Shenzhen, China, and Guangdong Longzee Interconnection Technology Co. Ltd. His patent work addresses surface modification of silica and materials designed for high-frequency flexible printed circuit applications.

Latest Patents

The available information identifies 1 patent associated with Minyu Zeng: “Silica Hollow Sphere with a MOF Composite Layer and Method for Preparing the Same.” The invention describes a hollow silica sphere with an amino-silane layer covalently grafted onto its surface. Amino groups provide nucleation sites for the in-situ growth of a ZIF-8 crystal layer, while thiol groups are distributed across the outer surfaces of the metal-organic framework crystals.

The patent’s stated objective is to provide a composite silica sphere with good compatibility and stability in a liquid crystal polymer (LCP) matrix while maintaining low dielectric loss. These properties are intended to support improved performance in high-frequency flexible printed circuits.

Career Highlights

Zeng’s identified patent reflects work at the intersection of silica surface modification, metal-organic framework materials, and electronic applications. The invention focuses on combining a hollow silica structure with functional surface layers to address material requirements in high-frequency circuits.

Collaborations

The supplied information associates Zeng with Guangdong Longzee Interconnection Technology Co. Ltd. and lists Xiquan Chen and Feng Qin as coworkers. The available details do not specify their individual roles in the patent or their broader professional relationship with Zeng.

Conclusion

Minyu Zeng’s identified invention presents a functionalized silica–MOF composite intended to balance compatibility, stability, and low dielectric loss for high-frequency flexible circuit applications.