This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Minsang Park and Semiconductor Chip Molding Technology
Introduction
Minsang Park is an inventor based in Suwon, South Korea, and is associated with Samsung Electronics Ltd. His patent work includes a device designed to mold multiple semiconductor chips.
Latest Patents
Park is credited with 1 patent: “Semiconductor Chip Molding Die Device.” The invention describes a die device with a lower die containing a moving plate and V-groove structures that suction a resin-coated release film. An upper die moves toward or away from the lower die to close or open the dies, and includes suction vent units to hold a substrate carrying semiconductor chips. The lower die also has a mechanism for manually adjusting the tension of a spring that supports the moving plate.
Career Highlights
Park’s listed patent reflects work on semiconductor manufacturing equipment, particularly die structures for molding multiple chips. His company affiliation is Samsung Electronics Ltd.
Collaborations
Park’s listed coworkers include Hwansoo Lee and Hoon Chang.
Conclusion
Minsang Park’s patent focuses on a semiconductor chip molding die that combines substrate and release-film suction with adjustable spring tension, contributing to the development of semiconductor manufacturing equipment.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile