Company Filing History:
2 out of 2,333 
1 out of 1,030 
1 out of 1 Years Active: 2010-2020
Title: Minoru Yamada: Innovator in Bonding Materials
Introduction
Minoru Yamada is a notable inventor based in Koganei, Japan. He has made significant contributions to the field of bonding materials, holding a total of 4 patents. His work focuses on developing compositions that enhance the bonding process between various substrates.
Latest Patents
Yamada's latest patents include a composition for bonding that features tin, germanium, and nickel. The composition specifies that the contained amount of germanium is less than or equal to 10 mass percent. Additionally, the amount of nickel is limited to a product of 2.8 multiplied by the contained amount of germanium raised to the power of 0.3. Another significant patent is for a bonding material that can effectively bond base materials or substrates with differing linear thermal expansion coefficients. This material exhibits heat resistance at temperatures of 300°C or higher, along with vacuum airtightness and bonding strength. The bonding material is created by mixing a metal Ga and/or a combination of Bi and Sn or their alloys with a BiO-based glass frit powder, allowing for excellent handleability and workability.
Career Highlights
Throughout his career, Minoru Yamada has worked with prominent companies such as Hitachi Metals, Ltd. and AGC Inc. His experience in these organizations has contributed to his expertise in the development of innovative bonding solutions.
Collaborations
Yamada has collaborated with notable individuals in his field, including Nobuhiko Chiwata and Atsushi Yamada. These collaborations have further enriched his work and expanded the impact of his inventions.
Conclusion
Minoru Yamada's contributions to bonding materials demonstrate his innovative spirit and dedication to advancing technology. His patents reflect a deep understanding of material science and engineering, making him a significant figure in his field.