The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Mar. 28, 2008
Applicants:
Nobuhiko Chiwata, Yasugi, JP;
Minoru Yamada, Koganei, JP;
Motoki Wakano, Yasugi, JP;
Inventors:
Assignee:
Hitachi Metals, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/06 (2006.01); C22C 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention provides a solder alloy containing, by mass, 2.0 to 15.0% of Ag, 0.1 to 6.0% of Al, 0.01 to 0.50% of Y, the balance being Sn and unavoidable impurities. The solder alloy preferably contains 0.01 to 0.50% of Ge by mass. The solder alloy of the invention is suited to bonding oxides together and the oxides preferably comprise glass. The invention provides a glass bonded body formed by bonding glasses with the use of the solder alloy.