Company Filing History:
Years Active: 2001
Title: Minoru Nakada: Innovator in Semiconductor Technology
Introduction
Minoru Nakada is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent work. His expertise and dedication to advancing technology have positioned him as a key figure in the industry.
Latest Patents
Minoru Nakada holds a patent for a semiconductor device with flip chip bonding pads and the manufacture thereof. This invention involves a semiconductor substrate that features a principal surface with an exposed pad made of conductive material. The design includes a first insulating film covering part of the principal surface, along with a base conductive film formed on both the first insulating film and the pad. The method he developed is particularly suitable for creating fine pitches between bump electrodes, showcasing his innovative approach to semiconductor manufacturing.
Career Highlights
Minoru Nakada is currently employed at Fujitsu Corporation, where he continues to contribute to advancements in semiconductor technology. His work has been instrumental in developing new methods and devices that enhance the performance and efficiency of semiconductor products.
Collaborations
Minoru Nakada has collaborated with notable colleagues, including Eiji Watanabe and Hirohisa Matsuki. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the field.
Conclusion
Minoru Nakada's contributions to semiconductor technology through his patent and work at Fujitsu Corporation highlight his role as an influential inventor. His innovative methods continue to shape the future of the semiconductor industry.