The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2001
Filed:
Nov. 16, 1998
Eiji Watanabe, Kawasaki, JP;
Hirohisa Matsuki, Kawasaki, JP;
Kenichi Kado, Kunitachi, JP;
Kenichi Nagashige, Kawasaki, JP;
Masanori Onodera, Kawasaki, JP;
Kunio Kodama, Kawasaki, JP;
Hiroyuki Yoda, Kawasaki, JP;
Joji Fujimori, Kawasaki, JP;
Minoru Nakada, Yokohama, JP;
Yutaka Makino, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor substrate is prepared which has a principal surface, an exposed pad made of conductive material being formed in a partial area of the principal surface, and the other area of the principal surface being covered with a first insulating film. A base conductive film is formed on the first insulating film and the pad. A photoresist film having a thickness of 50 &mgr;m or thicker is formed on the base conductive film. An opening is formed through the photoresist film in an area corresponding to the pad to expose a partial surface area of the base conductive film. A conductive bump electrode is deposited on the base conductive film exposed on a bottom of the opening. The photoresist film is removed. This method is suitable for making a fine pitch between bump electrodes.