Aizuwakamatsu, Japan

Kunio Kodama


Average Co-Inventor Count = 6.9

ph-index = 4

Forward Citations = 144(Granted Patents)


Location History:

  • Kawasaki, JP (1998 - 2001)
  • Aizuwakamatsu, JP (2002)

Company Filing History:


Years Active: 1998-2002

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4 patents (USPTO):Explore Patents

Title: Kunio Kodama: Innovator in Semiconductor Manufacturing

Introduction

Kunio Kodama is a prominent inventor based in Aizuwakamatsu, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 4 patents. His innovative approaches have paved the way for advancements in the efficiency and effectiveness of semiconductor devices.

Latest Patents

Kodama's latest patents include a method of manufacturing solder bumps and solder joints using formic acid. This semiconductor device manufacturing method involves forming solder bumps on an underlying metal film of a semiconductor device. The process takes place in a reduced pressure atmosphere containing formic acid, allowing for the formation of solder bumps without flux generating voids in the solder layer. This innovation eliminates the need for cleaning after the solder bumps are formed.

Another notable patent is for a semiconductor device with flip chip bonding pads and its manufacture. This method involves preparing a semiconductor substrate with a principal surface and an exposed pad made of conductive material. A base conductive film is formed on the first insulating film and the pad, followed by the deposition of a conductive bump electrode. This technique is particularly suitable for creating a fine pitch between bump electrodes.

Career Highlights

Kunio Kodama is currently employed at Fujitsu Corporation, where he continues to develop cutting-edge technologies in semiconductor manufacturing. His work has significantly impacted the industry, enhancing the performance and reliability of semiconductor devices.

Collaborations

Kodama has collaborated with notable colleagues, including Eiji Watanabe and Hirohisa Matsuki. Their combined expertise has contributed to the successful development of innovative semiconductor technologies.

Conclusion

Kunio Kodama's contributions to semiconductor manufacturing through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in technology, making a lasting impact on the industry.

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