Fujitsu Corporation

Kunio Kodama

Masataka Mizukoshi

Hirohisa Matsuki

Eiji Watanabe

Toshiyuki Motooka

Tatsuharu Matsuda

Joji Fujimori

Masanori Onodera

Masashi Takenaka

Kenichi Nagashige

Fumihiko Taniguchi

Yutaka Makino

Shigeki Harada

Hiroyuki Matsui

Hiroyuki Yoda

Kenichi Kado

Syuichirou Takahashi

Jouji Fujimori

Tatsuro Yamashita

Syuichirou Takahasi

Minoru Nakada

A semiconductor device manufacturing method comprises the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing formic acid to form the solder bumps. Accordingly, the solder bumps can be formed without flux generating voids in the solder layer. Furthermore, the cleaning required after the solder bumps are formed can be omitted.

Method of manufacturing solder bumps and solder joints using formic acid

A semiconductor substrate is prepared which has a principal surface, an exposed pad made of conductive material being formed in a partial area of the principal surface, and the other area of the principal surface being covered with a first insulating film. A base conductive film is formed on the first insulating film and the pad. A photoresist film having a thickness of 50 &mgr;m or thicker is formed on the base conductive film. An opening is formed through the photoresist film in an area corresponding to the pad to expose a partial surface area of the base conductive film. A conductive bump electrode is deposited on the base conductive film exposed on a bottom of the opening. The photoresist film is removed. This method is suitable for making a fine pitch between bump electrodes.

Semiconductor device with flip chip bonding pads and manufacture thereof

A test board used for testing a semiconductor device provided with projection electrodes includes a main board and testing electrodes. The testing electrodes are provided on the main board, each projecting upwardly from the main board. When the semiconductor device is tested, the testing electrodes are electrically connected to the projection electrodes by insertion of the testing electrodes into the projection electrodes. The semiconductor device is mounted on the main board to test the semiconductor device through the testing electrodes.

Test board for testing a semiconductor device and method of testing the

Test board for testing a semiconductor device, method of testing the

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Aizuwakamatsu, Japan

Kunio Kodama