This inventor holds 4 USPTO granted patents. Top assignees: Asahi-Dow Limited, The Dow Chemical Company. Active years: 1982-1985.
Company Filing History:
Years Active: 1982-1985
Title: Minoru Hisamatsu: Innovator in Electroconductive Polyolefin Resins
Introduction
Minoru Hisamatsu is a notable inventor based in Suzuka, Japan. He has made significant contributions to the field of materials science, particularly in the development of electroconductive polyolefin resin compositions. His innovative work has led to the filing of 4 patents that enhance the packaging of sensitive electronic components.
Latest Patents
His latest patents include a foamable electroconductive polyolefin resin composition. This composition consists of 70 to 95 weight percent of a polyolefinic resin and 5 to 30 weight percent of an electrically-conductive particulate furnace black. The specific surface area of the black is at least 900 square meters per gram. Foam products created from this composition, preferably through extrusion foaming, are particularly useful for packaging sensitive electronic parts. Another significant patent is for a foamable polyolefin resin composition. This involves electroconductive olefin polymer foams that serve as effective packaging and cushioning materials for sensitive electronic parts. These foams are prepared from olefin polymer compositions that include a major proportion of an olefin polymer, 5 to 30 weight percent of electroconductive carbon black, and 0.1 to 10 weight percent of a saturated fatty acid amide compound.
Career Highlights
Minoru Hisamatsu has worked with prominent companies in the industry, including The Dow Chemical Company and Asahi-Dow Limited. His experience in these organizations has allowed him to refine his expertise in polymer science and innovation.
Collaborations
Some of his notable coworkers include Akira Fujie and Tsuneo Hoki. Their collaborative efforts have contributed to advancements in the field of electroconductive materials.
Conclusion
Minoru Hisamatsu's work in developing electroconductive polyolefin resin compositions has made a significant impact on the packaging of electronic components. His innovative patents and collaborations highlight his role as a key figure in materials science.