The Dow Chemical Company

Asahi-dow Limited

Minoru Hisamatsu

Tsuneo Hoki

Akira Fujie

A foamable, electroconductive polyolefinic resin composition comprising 70 to 95 weight percent of a polyolefinic resin and 5 to 30 weight percent of an electrically-conductive particulate furnace black having a specific surface area of at least 900 square meters per gram. Foam products prepared from this composition, preferably by extrusion foaming, are particularly useful for packaging sensitive electronic parts.

Foamable electroconductive polyolefin resin compositions

Electroconductive olefin polymer foams which are suitable for use as packaging/cushioning materials for sensitive electronic parts are prepared from olefin polymer compositions which comprise a major proportion by weight of an olefin polymer, from 5 to 30 weight percent, based on said olefin polymer, of an electroconductive carbon black and from 0.1 to 10 weight percent, based on said olefin polymer of a saturated fatty acid amide compound.

Foamable polyolefin resin composition

Substantially closed-cell aliphatic olefin polymer foams having improved dimensional stability are provided by the inclusion therein of from 0.1 to 10 weight percent, based upon the olefin polymer, of certain naphthyl amine compounds.

Growing community of inventors

Suzuka, Japan

Minoru Hisamatsu